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M E 435: Joining of Materials: Structural, Electronic, Bio and Nano Materials

  • Catalog Description:
    Structural (metallic, ceramic, plastic, composite): welding, soldering, brazing, diffusion bonding, adhesive bonding. Electronic: wave and reflow soldering; wire, flip-chip and wafer bonding. Bio: hip and knee implants; dental restorations and implants; medical devices. Nano: nano tubes, wires, fibers and composites.
  • Credits: 3
  • Prerequisites: MS&E 350 or 351 or cons inst
  • Official Course Description (pdf)