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M E 435: Joining of Materials: Structural, Electronic, Bio and Nano Materials

  • Catalog Description:
    Structural (metallic, ceramic, plastic, composite): welding, soldering, brazing, diffusion bonding, adhesive bonding. Electronic: wave and reflow soldering; wire, flip-chip and wafer bonding. Bio: hip and knee implants; dental restorations and implants; medical devices. Nano: nano tubes, wires, fibers and composites.
  • Credits: 3
  • Prerequisites: MS&E 350 or 351 or cons inst
  • Official Course Description (pdf)

    Moodle and D2L are being retired. Already, many Engineering courses are in Canvas rather than Moodle. Rather than using the Moodle links below, it is recommended that you use the Learn@UW site (learnuw.wisc.edu) to gain access to all of the LSM choices available to campus.